Product Description & Reviews
8 - 3M - 3762LMQ Low-Melt Glue Sticks. Low-melt is applied at 265 degrees F. to bond heat sensitive substrates such as polystyrene foam. Excellent hot-tack when dispensed at low-melt temperatures. Can bond expanded polystyrene, corrugated packaging and displays. 25 second bonding range. FDA listed. 165 Per CaseLow-melt is applied at 265 degrees F. to bond heat sensitive substrates such as polystyrene foam.. Low-Melt Glue. 165 PER CASE.
Features & Highlights
- Low-melt is applied at 265 degrees F. to bond heat sensitive substrates such as polystyrene foam.
- Low-Melt Glue
- 165 PER CASE
|Part Number:||3762 LMQ|
|Item Weight:||11.8 pounds|
|Item Size:||8.25 x 6.5 x 6.5 inches|
|Package Weight:||12.04 pounds|
|Package Size:||8.35 x 6.77 x 6.77 inches|
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